LPS® MAX CFC Free NU Low VOC Contact Cleaner

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This residue-free, fast-drying formula contains no chlorinated solvents and is safe on plastics. The low VOC formula removes dirt, moisture, dust, flux, and oxides from the internal components of electronic or precision equipment such as circuit board. Conforms to VOC regulations of CARB, OTC, and LADCO.

FEATURES

  • Meets air quality standards and is plastic-safe
  • Fast evaporating, no residue
  • Does not contain HCFCs
  • Fast acting and fast penetrating
  • Low odor
  • Nozzle provides targeted or broad stroke application
  • Contoured can for improved hand grip

APPLICATIONS

  • Connectors
  • Contacts
  • Magnetic Tape Heads
  • Printed Circuits
  • Office Equipment
  • Semiconductor Assemblies
  • Switches
  • Telecommunications Equipment

SPECIFICATIONS

Packaging Details

Part No. US Net Contents Container Type Units/Case Case Weight
95416 11 wt oz / 312 g / 416 mL aerosol 12 11 lbs

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Properties

Appearance / Physical State Gas
Auto-Ignition Temperature 582.8°F (306°C)
Boiling Point / Range 140.9 °F (60.5 °C) Dispensed liquid
Color Clear colorless or nearly colorless
Evaporation Rate < 1 (Ethyl Ether = 1)
Heat of Combustion > 30 kJ/g
Melting / Freezing Point -198.4 °F (-128 °C) estimated
Odor Mild
Partition Coefficient Not established
Percent Volatile 100%
Prop 65 Warning Yes
Propellant HFC-152a
Specific Gravity 0.8 - 0.82 @ 20°C
Vapor Density >1 (air = 1)
Vapor Pressure 352.53 mm Hg @ 38°C
Viscosity < 3 cSt @ 25°C
VOC Content 74% per State and Federal Consumer Product Regulations; 600 g/L per SCAQMD Rule 102

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